Micro Magic, Inc.
Micro Magic tools provide fully integrated design flow management, graphical design entry, datapath and memory compilers, and the world's fastest SoC layout editing and viewing system with realtime DRC. If you're doing 3D design (stacked) or interposer design, the MMI MAX-3D Design Suite is the only toolset designed from bottom up to be fully 3D aware..
MMI's suite of 3D tools includes DPC-SUE, MAX-3D, MAX-3D TSV Placer, MAX-3D Path Finder, and MAX-3D System Layout & Package Co-Design.
Using one environment, you can now really visualize and modify the project as an entity, without piecing aspects together from many disparate sources. Unification of the process speeds design efficiency and reduces the potential for error. The following video clips, taken real-time, show just a small portion of the capabilities of MAX-3D System.
MAX is the fastest Layout System on the planet. Benchmarks have proven MAX to be 50X faster in displaying physical layout data. All MAX Layout tools offer 3-D VIEWING of layout.
MAX-3D TSV Placer is a simple-to-use, powerful tool for automatic TSV location, optimization and placement.
Using MAX-3D Path Finder it's now possible to explore viability of interposer or stacked-die implementations to evaluate potential TSV designs.
MAX Layout Editors -- speed, power, ease-of-use -- able to load, view, and edit designs of more than one trillion (1,000,000,000,000) devices in real time.
MAX is the fastest Layout System on the planet. Benchmarks have proven MAX to be 50X faster in displaying physical layout data. All MAX Layout tools offer 3-D VIEWING of layout.
Use DPC to make your datapaths faster, smaller, lower power, easier to route.
Use SUE from an architectural level to plan your design, and manage the design process and environment.
SUE SoC Design Manager Everything needed to manage today's SoC Design Flow
SUE combines Verilog, Schematic Capture, Documentation, Timing and Simulation tools to plan and manage your SoC project. More on SUE...
DPC for Datapaths Faster, Smaller, Lower Power, Easier routing
Micro Magic's DPC Datapath Compiler can place, route and time 100K gates/min. DPC will analyze congestion, and generates a custom-like bit-slice placement to improve timing and routing.More on DPC...
MAX-3D Path Finder Quickly and Automatically evaluate viability of 3D
Path Finder helps determine whether 3D TSV wafer stack is the best solution for your project. Use MAX-3D Path Finder to analyze partitioning, extract and simulate 3D nets, and generally explore the viability of an interposer or stacked-die implementation.More on Path Finder...
MAX-3D Layout The tool for true 3-Dimensional Layout
Load multilple chips/wafers and maintain distinct tech files for each layer. Full-featured editing for each tech file with real-time redisplay.More on MAX-3D ...
MAX-3D TSV Placer Automatic TSV Location, Optimization and Placement
MAX-3D TSV Placer scans your multi-level layout for optimal legal TSV placement. You can also adjust layout and insert blocking layers to modify placements if required. More on TSV Placer...
MAX-3D System The tool for chip/package/board co-design.
MAX-3D System enables you to view, edit and analyze multiple wafers/layers of one chip stack up thru the package and across the board to another chip stack. More on MAX-3D System...
The MAX-3D Design Suite contains everything necessary to plan and lay out today's complex wafer-stack and interposer multi-technology designs.
to import designs from either 2D floorplanner or block-level verilog; specify chip level, block size, connectivity; and export floorplan to MAX-3D.
to explore viability of interposer or stacked-die implementations. Do multiple "what-if" studies on many different partitions.
for true 3-dimensional layout, supporting multiple distinct technooogy files for Through-Si Via 3D wafer-stack and interposer designs.
for automaticfally locating, optimizing and placing TSVs.
for the first time - your chips, package and PC board all together, in one tool. View, analyse & edit all of them in one environment. Isolate and extract nets; study signal integrity across all components.
“Tezzaron has taped out over 100 3D chips using MMI’s MAX-3D tool suite. There’s nothing to compare, and the new TSV placer & MAX-3D Path Finder are incredible.”
Robert Patti, VP/CTO, Tezzaron Semiconductor
“This is one of the few tools that can deal with multiple levels of hierarchy and multiple tech files all at the same time, and it is awesome for visualization of complex things like, say, PDN mesh across multiple die and interposers. Fantastic! I like it!”
Riko Radojcic, Director of Design for Silicon Initiatives, Qualcomm
Micro Magic, Inc.'s mission is to dramatically reduce the time and cost required to produce high-performance SoC designs. Tools, Design Services, or Consulations... We Can Help.
1025 Heatherstone Ave. Sunnyvale, CA. 94087
Micro Magic, Inc. is a privately held company. We build, use and sell our own high-end CAD tools.
