- True 3-Dimensional Layout
- Fastest Layout Editor Available
- Easy to Use
- Integrated Calibre ® Interface
The World's First True 3-D Layout Editor
MAX-3D is the only true 3D layout editor, handling multiple technologies with true Through-Via capability.
MAX-3D can handle your largest multi-wafer IC designs -- in the trillions of devices. Even the largest designs redraw in real time.
Enabling 'Through-Silicon Via Wafer Stack' Technology
Through-Si Via Wafer Stacking is a technology allowing faster interconnects between discrete wafers. This is accomplished by connecting wafers of varying technologies together with vias through the wafers yielding a single 3-D stacked chip. For example, a Microprocessor in 32 nm technology can be combined with a Memory in 65 nm technology and an Analog device in 180 nm technology without writing a new tech file! (see diagram).
With MAX-3D, levels can be edited separately, or concurrently - without writing a new tech file. Tech files for each wafer level are maintained individually, and you can edit technologies for different wafer levels in the same view.
MAX-3D has the capacity and speed to handle these large and complex designs. It also provides connectivity tracing, database management, and all its layout editor features through the design.
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Figure 1.
Illustration of Three Different Technologies in Three Different Layers, Joined with Through-Silicon Vias and Bonding Layers.
Figure 2 .
Actual Screenshot of MAX-3D Layout Editor -- True Through-Silicon Via Layout and Editing Using Multiple Technologies at the Same Time..
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