Using one environment, you can now really visualize and modify the project as an entity, without piecing aspects together from many disparate sources. Unification of the process speeds design efficiency and reduces the potential for error. The following video clips, taken real-time, show just a small portion of the capabilities of MAX-3D System.
MAX-3D System enables designers to view, analyze and edit across all parts in one tool, together, or individually. Separate technology files are maintained for each layer. Now, you are able to isolate and extract nets and study signal integrity across all components at the same time.
Below are close-up images of MAX-3D System. In the upper image, the chip and package layers are visible.
In the lower image, several nets have been selected, showing their placement from the chip levels up through the package layer.
“Tezzaron has taped out over 100 3D chips using MMI’s MAX-3D tool suite. There’s nothing to compare, and the new TSV placer & MAX-3D Path Finder are incredible.”Robert Patti, VP/CTO, Tezzaron Semiconductor
“This is one of the few tools that can deal with multiple levels of hierarchy and multiple tech files all at the same time, and it is awesome for visualization of complex things like, say, PDN mesh across multiple die and interposers. Fantastic! I like it!”Riko Radojcic, Director of Design for Silicon Initiatives, Qualcomm