MAX-3D System Co-Design Header

MMI 3-D TSV/Wafer-Stack Co-Design tools

MAX-3D System

Finally - Chip/Package/Board Unified

MAX-3D System is the first tool capable of loading, analyzing and editing all components of a 3D-TSV wafer stack design.

Using one environment, you can now really visualize and modify the project as an entity, without piecing aspects together from many disparate sources. Unification of the process speeds design efficiency and reduces the potential for error. The following video clips, taken real-time, show just a small portion of the capabilities of MAX-3D System.

In the video clip above, we begin with a top-down view of several chips and package layer, turning on/off the visibility of different layers. Then, you see that nets have been selected and traced from one chip up to the package layer, across the PC board, down to the second set of TSV chips.

MAX-3D System enables designers to view, analyze and edit across all parts in one tool, together, or individually. Separate technology files are maintained for each layer. Now, you are able to isolate and extract nets and study signal integrity across all components at the same time.

All MMI Layout Tools provide the three-dimensional display. This video clip demonstrates how easy it can be to select and analyze a net and the halo. You can clearly see the haloing effect displayed at the end. All operations happen quickly, with the click of a menu selection.

Below are close-up images of MAX-3D System. In the upper image, the chip and package layers are visible.

In the lower image, several nets have been selected, showing their placement from the chip levels up through the package layer.

Close up of chips + package layer
Close up view of nets selected from chip thru package Above, a closeer view of 3D-MAX System showing the chips and packaging layer, with TSVs being outlined in white. Below, nets selected from chips up through package layer.

MAX-3D System, together with MAX-3D TSV Placer, and MAX-3D Path Finder, offer a comprehensive means of successfully designing, testing and producing today's complex three-dimensional TSV layouts.

MAX-3D System

  • Chip-to-Board viewing and editing - in 3D.
  • Load Chip, Package and Board together, in one tool.
  • Isolate and extract nets; study signal inegrity across all components.
  • View, edit and analyze chips, package and board in one environment.

The MAX-3D Design Suite

MAX-3D System is part of Micro Magic's 3D Design Suite together with MAX-3D TSV Placer and MAX-3D Path Finder

MAX-3D Design Suite Consists of:

Comments From Customers

“Tezzaron has taped out over 100 3D chips using MMI’s MAX-3D tool suite. There’s nothing to compare, and the new TSV placer & MAX-3D Path Finder are incredible.”

Robert Patti, VP/CTO, Tezzaron Semiconductor

“This is one of the few tools that can deal with multiple levels of hierarchy and multiple tech files all at the same time, and it is awesome for visualization of complex things like, say, PDN mesh across multiple die and interposers. Fantastic! I like it!”

Riko Radojcic, Director of Design for Silicon Initiatives, Qualcomm