IC Design Tools

MMI IC Design Tools



Micro Magic, Inc. provides tools for all aspects of IC layout and design including specialized tools for Datapath Design, SoC Design Management and a powerful, specialized program for memories and other regular structures, MCC - Megacell Compiler.

Tools offered by MMI Include:

DPC-SUE, MCC, MAX-3D Suite, MAX-Family Layout



 

DPC-SUE

DPC + SUE

Micro Magic's
DPC Datapath Tool +SUE SoC Design Environment

  • Place, route and time 100K gates per minute
  • Regular bit-slice placement reduces congestion and wire length, reducing size and power
  • Gate Auto-sizer automatically improves timing and power
  • Uses all existing standard cell libraries
  • OpenAccess compliant

 

Information on DPC + SUE...

DPC Datapath Optimizer + SUE SoC Design Environment

DPC-SUE Datasheet
DPC-SUE Datasheet interior DPC-SUE Information in PDF

MCC: MegaCell Tool

MCC - MegaCell Compiler

For Large, Regular Structures

MegaCell Compiler (MCC) is an easy, powerful tool for building regular structures such as SRAMs, CAMs, DRAMs, Register files, FIFOs, ROMs, and PLAs.

MCC significantly reduces the effort required for building custom memories.

Information on MCC MegaCell Compiler...

MCC MegaCell Compiler

MCC MegaCell CompilerMCC MegaCell Compiler Pg 2 MCC MegaCell Compiler PDF

MAX-3D Design Suite

MAX-3D Design Suite

3D Tools for 3D Designs

MMI MAX-3D Design Suite includes MAX-3D System, MAX-3D Path Finder, MAX-3D TSV Placer, and MAX-3D Layout.

Information on MAX-3D Design Suite...

MAX-3D Design Suite: MAX-3D System, MAX-3D Path Finder, MAX-3D TSV Placer

MMi 3D Design Suite MMI 3D Design Suite - pg 2 MMI MAX-3D Design Suite PDF

MAX-Family Layout

MAX-Family Layout

Fast, powerful, production-proven, easy to use layout tools.

Full-custom layout, schematic-driven layout, chip assembly, 3D stacked designs and more for all your physical design needs.


Information on MAX-Family Layout...

MAX-Family Layout: MAX-3D, MAX-LS, MAX, MAX-View

MAX-Family Datahseet - 1 MAX-Family Datasheet - 2 MAX-Family Layout Editors PDF

MMI's Tools Interface Seamlessly with Existing Tools

Interactive - click/tap categories
Example 3D Design Flow

Synthesis/ P&R Integrates easily with your current Synthesis/P&R tools

SUE SoC Design Manager Everything needed to manage today's SoC Design Flow
SUE combines Verilog, Schematic Capture, Documentation, Timing and Simulation tools to plan and manage your SoC project. More on SUE...

DPC for Datapaths Faster, Smaller, Lower Power, Easier routing
Micro Magic's DPC Datapath Compiler can place, route and time 100K gates/min. DPC will analyze congestion, and generates a custom-like bit-slice placement to improve timing and routing.More on DPC...

Physical VerificationIntegrate seamlessly with your current Physical Verification tools.

MAX-3D Path Finder Quickly and Automatically evaluate viability of 3D
Path Finder helps determine whether 3D TSV wafer stack is the best solution for your project. Use MAX-3D Path Finder to analyze partitioning, extract and simulate 3D nets, and generally explore the viability of an interposer or stacked-die implementation.More on Path Finder...

MAX-3D Layout The tool for true 3-Dimensional Layout
Load multilple chips/wafers and maintain distinct tech files for each layer. Full-featured editing for each tech file with real-time redisplay.More on MAX-3D ...

MAX-3D TSV Placer Automatic TSV Location, Optimization and Placement
MAX-3D TSV Placer scans your multi-level layout for optimal legal TSV placement. You can also adjust layout and insert blocking layers to modify placements if required. More on TSV Placer...

MAX-3D System The tool for chip/package/board co-design.
MAX-3D System enables you to view, edit and analyze multiple wafers/layers of one chip stack up thru the package and across the board to another chip stack. More on MAX-3D System...

Verilog & Circuit SimEasy, programmable UI integration with your Verilog/Circuit Sim tools.

DPC-SUE

to import designs from either 2D floorplanner or block-level verilog; specify chip level, block size, connectivity; and export floorplan to MAX-3D.

MAX-3D Path Finder

to explore viability of interposer or stacked-die implementations. Do multiple "what-if" studies on many different partitions.

MAX-3D

for true 3-dimensional layout, supporting multiple distinct technooogy files for Through-Si Via 3D wafer-stack and interposer designs.

MAX-3D TSV Placer

for automaticfally locating, optimizing and placing TSVs.

MAX-3D System

for the first time - your chips, package and PC board all together, in one tool. View, analyse & edit all of them in one environment. Isolate and extract nets; study signal integrity across all components.

 


Comments From Customers

“Tezzaron has taped out over 100 3D chips using MMI’s MAX-3D tool suite. There’s nothing to compare, and the new TSV placer & MAX-3D Path Finder are incredible.”

Robert Patti, VP/CTO, Tezzaron Semiconductor

“This is one of the few tools that can deal with multiple levels of hierarchy and multiple tech files all at the same time, and it is awesome for visualization of complex things like, say, PDN mesh across multiple die and interposers. Fantastic! I like it!”

Riko Radojcic, Director of Design for Silicon Initiatives, Qualcomm