MAX-3D Layout

MMI 3-D TSV/Wafer-Stack Co-Design tools

MAX-3D True 3-Dimensional Layout

Based on MAX, the world's fastest layout tool

MAX-3D for True three-dimensional designs using multiple technologies

MAX-3D enables 'Through-Silicon Via Wafer Stack' Technology - a technology allowing faster interconnects between discrete wafers. This is accomplished by connecting wafers of varying technologies together with vias through the wafers yielding a single 3-D stacked chip.

Through-Si Via Wafer Stack Example Multiple-Wafer Chip with Through-Si vias

MAX-3D maintains discreet technology files for each wafer level, while allowing edits to individual levels, or to the stack as a whole. The video below illustrates how layers can be made visible, edited independently, or as a unit.

Three distinct wafers: Turning visibility on/off, and tracing nets between different wafers


MAX-3D True-3D Layout

MAX-3D has the capacity and speed to handle these large and complex designs. Features such as limiting editing to a single wafer, or connectivity tracing through multiple wafers, make MAX-3D the only editor for your3D designs.

MAX-3D is packed with helpful features, such as automatic bus wiring shown here, and on-line interactive DRC.

The MAX-3D True-3D Layout

MAX-3D True-3D Layout is part of the MMI MAX-Family of Layout Editors

MAX-Family Layout Consists of:
MAX, MAX-LS, MAX-3D, and MAX-View Layout viewer

About Micro Magic, Inc. Tools

All MMI tools interface seamlessly with other point tools. You have the ability to augment your existing flow with MMI tools as desired.

All MMI tools run on LINUX, are straightforward to set up and use, and all tools include on-line documentation and tutorials. MMI tools are so easy to use than any engineer can install them in the morning, and begin producing layout in the afternoon.

MMI prides itself on customer service and timely response to queries and comments.

Proven Layout Tools by Proven Layout Designers.