MAX 3D Suite

MMI 3D Design Suite

Micro Magic tools provide fully integrated design flow management, graphical design entry, datapath and memory compilers, and the world's fastest SoC layout editing and viewing system with realtime DRC. If you're doing 3D design (stacked) or interposer design, the MMI MAX-3D Design Suite is the only toolset designed from bottom up to be fully 3D aware..

3D Design Suite:
3D Tools for 3D Designs

Built on MAX-3D, MMI's native 3D editor

MMI's suite of 3D tools includes DPC-SUE, MAX-3D:, MAX-3D TSV Placer, MAX-3D Path Finder, and MAX-3D System Layout & Package Co-Design.

MAX-3D System

MAX-3D System

Finally: Chip, Package and Board Unified

Using one environment, you can now really visualize and modify the project as an entity, without piecing aspects together from many disparate sources. Unification of the process speeds design efficiency and reduces the potential for error. The following video clips, taken real-time, show just a small portion of the capabilities of MAX-3D System.

MAX is the fastest Layout System on the planet. Benchmarks have proven MAX to be 50X faster in displaying physical layout data. All MAX Layout tools offer 3-D VIEWING of layout.

Full info on MAX-3D System
MAX-3D System: Chip-to-Package MAX-3D System: Chip-to-Package-to-Board Co-Design

MAX-3D TSV Placer

MAX-3D TSV Placer

Auto TSV Placement

MAX-3D TSV Placer is a simple-to-use, powerful tool for automatic TSV location, optimization and placement.

Full info on MAX-3D TSV Placer
MMI TSV Placer TSV Placer: Flylines show TSV locations

MAX-3D Path Finder

MAX-3D Path Finder

Explore Viability of TSV Designs

Using MAX-3D Path Finder it's now possible to explore viability of interposer or stacked-die implementations to evaluate potential TSV designs.

Full info on MAX-3D Path Finder
MMI Path Finder MAX-3D Path Finder: Automatic Bus Wiring and PDN

MAX-3D Layout

MAX FAMILY Layout Editors

MAX-3D True-3D TSV Layout, part of the MAX Family of layout tools: MAX-3D, MAX-LS, MAX, MAX-View, all with 3D editing and display

MAX Layout Editors -- speed, power, ease-of-use -- able to load, view, and edit designs of more than one trillion (1,000,000,000,000) devices in real time.

MAX is the fastest Layout System on the planet. Benchmarks have proven MAX to be 50X faster in displaying physical layout data. All MAX Layout tools offer 3-D VIEWING of layout.

Information on MAX Family...
MAX-3D Image
MAX-3D True 3-D TSV Layout MAX-3D enables true three-dimensional 'Through-Silicon Via Wafer Stack' Technology

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Selecting a net across multiple die
MAX-LS Schematic-Driven Layout MAX-LS Combines MAX-3D and Schematic-Driven layout

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Example of Schematic-Driven Layout in MAX-LS
MAX Layout image
MAX Layout Editor MAX Layout Editor with real-time interactive DRC

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MAX Layout Editor: Full-featured Layout with Real-time DRC
MAX-View image
MAX-View Layout Viewer MAX-View: a 3-dimensional viewer of any layout.

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MAX-View: Display any layout with 3D and Rotation



Datapath Design combined with SUE SoC Design Manager

Use DPC to make your datapaths faster, smaller, lower power, easier to route.

Use SUE from an architectural level to plan your design, and manage the design process and environment.

Information on DPC + SUE...
DPC-SUE image Critical Path shown in SUE and DPC. Import Verilog, generate schematic, display critical path.

MMI's MAX-3D Design Suite

Example 3D Design Flow

Synthesis/ P&R Integrates easily with your current Synthesis/P&R tools

SUE SoC Design Manager Everything needed to manage today's SoC Design Flow
SUE combines Verilog, Schematic Capture, Documentation, Timing and Simulation tools to plan and manage your SoC project. More on SUE...

DPC for Datapaths Faster, Smaller, Lower Power, Easier routing
Micro Magic's DPC Datapath Compiler can place, route and time 100K gates/min. DPC will analyze congestion, and generates a custom-like bit-slice placement to improve timing and routing.More on DPC...

Physical VerificationIntegrate seamlessly with your current Physical Verification tools.

MAX-3D Path Finder Quickly and Automatically evaluate viability of 3D
Path Finder helps determine whether 3D TSV wafer stack is the best solution for your project. Use MAX-3D Path Finder to analyze partitioning, extract and simulate 3D nets, and generally explore the viability of an interposer or stacked-die implementation.More on Path Finder...

MAX-3D Layout The tool for true 3-Dimensional Layout
Load multilple chips/wafers and maintain distinct tech files for each layer. Full-featured editing for each tech file with real-time redisplay.More on MAX-3D ...

MAX-3D TSV Placer Automatic TSV Location, Optimization and Placement
MAX-3D TSV Placer scans your multi-level layout for optimal legal TSV placement. You can also adjust layout and insert blocking layers to modify placements if required. More on TSV Placer...

MAX-3D System The tool for chip/package/board co-design.
MAX-3D System enables you to view, edit and analyze multiple wafers/layers of one chip stack up thru the package and across the board to another chip stack. More on MAX-3D System...

Verilog & Circuit SimEasy, programmable UI integration with your Verilog/Circuit Sim tools.

The MAX-3D Design Suite contains everything necessary to plan and lay out today's complex wafer-stack and interposer multi-technology designs.

  • Load multiple chips in the same or different technologies.
  • Manage multiple levels of hierarchy and multiple tech files all at the same time.
  • Edit and view today's largest designs.
  • Automatic Connectivity Tracing through multiple levels, even through the package.
  • Show 3D connectivity with fly-lines.
  • Use your existing 2D Tech Files.
  • View results in 3D.


to import designs from either 2D floorplanner or block-level verilog; specify chip level, block size, connectivity; and export floorplan to MAX-3D.

MAX-3D Path Finder

to explore viability of interposer or stacked-die implementations. Do multiple "what-if" studies on many different partitions.


for true 3-dimensional layout, supporting multiple distinct technooogy files for Through-Si Via 3D wafer-stack and interposer designs.

MAX-3D TSV Placer

for automaticfally locating, optimizing and placing TSVs.

MAX-3D System

for the first time - your chips, package and PC board all together, in one tool. View, analyse & edit all of them in one environment. Isolate and extract nets; study signal integrity across all components.

Comments From Customers

“Tezzaron has taped out over 100 3D chips using MMI’s MAX-3D tool suite. There’s nothing to compare, and the new TSV placer & MAX-3D Path Finder are incredible.”

Robert Patti, VP/CTO, Tezzaron Semiconductor

“This is one of the few tools that can deal with multiple levels of hierarchy and multiple tech files all at the same time, and it is awesome for visualization of complex things like, say, PDN mesh across multiple die and interposers. Fantastic! I like it!”

Riko Radojcic, Director of Design for Silicon Initiatives, Qualcomm