TSV Datasheet header

MMI 3-D TSV/Wafer-Stack Co-Design tools

MAX-3D TSV Placer

Automatic TSV Placement

MAX-3D TSV Placer is a simple-to-use, powerful tool for automatic TSV location, optimization and placement.

MAX-3D TSV Placer automatically finds "holes" for TSVs, and then automatically optimizes and places the TSVs.

TSV Placer shows 3D connectivity with flylines, and exports the TSV data back into your 2D tools.

TSV Flylines TSV Placer shows flylines for connectivity points between three chip levels.
TSVs placed Here, TSVs correctly positioned between each wafer level.

MAX-3D TSV Placer

  • Automatically finds 'holes' for TSVs
  • Automatically optimizes and places TSVs
  • Shows 3D connectivity with fly-lines
  • Exports TSV data back into your 2D tools

MAX-3D TSV Placer is part of Micro Magic's 3D Design Suite together with MAX-3D Path Finder, and MAX-3D System

Comments From Customers

“Tezzaron has taped out over 100 3D chips using MMI’s MAX-3D tool suite. There’s nothing to compare, and the new TSV placer & MAX-3D Path Finder are incredible.”

Robert Patti, VP/CTO, Tezzaron Semiconductor

“This is one of the few tools that can deal with multiple levels of hierarchy and multiple tech files all at the same time, and it is awesome for visualization of complex things like, say, PDN mesh across multiple die and interposers. Fantastic! I like it!”

Riko Radojcic, Director of Design for Silicon Initiatives, Qualcomm